Yukio Sakabe, Murata Manufacturing Company, Japan
Gary Messing, Pennsylvania State University, USA
Joachim Maier, Max-Planck Institute Stuttgart, Germany
Sungi Baik, POSTECH, Korea
Slavko Bernik, Institute Jozef Stefan, Slovenia
Dave Blank, University Twente, The Netherlands
Bernard Boukamp, University of Twente, The Netherlands
Robert Bowman, Queens University Belfast, UK
Paulo Bueno, University Estadual Paulista, Brazil
X.M. Chen, Zhijang University, China
Dionizy Czekaj, University of Silesia, Poland
Juergen Fleig, Technical University Vienna, Austria
Miguel Garcia, La Rozas, Madrid, Spain
Felix Greuter, ABB, Switzerland
Alexei Gruverman, University of Nebraska-Lincoln, USA
Christian Hoffmann, EPCOS, Deutschlandsberg, Austria
Jiri Hlinka, Institute of Physics, Prague, Czech Republic
M. Saiful Islam, University of Bath, UK
Lutgard de Jonghe, University of California Berkeley, USA
C.R. Kleijn, Delft University of Technology, The Netherlands
Taras Kolodiazhnyi, NIMS, Tsukuba, Japan
Andrey Kozyrev, St Petersburg Electrotechnical University, Russia
Marc Lethiecq, University of Tours, France
Igor Levin, NIST, Gaithersburg, USA
Jing-Feng Li, Tsinghua University, China
Doru Lupascu, Technical University Dreaden, Germany
Mogens Mogensen, Riso, Denmark
Rosa Merino, CSIC Zaragoza, Spain
Paul Muralt, EPFL, Switzerland
Cewen Nan, Tsinghua University, China
Wolfgang Preis, Montanuniversität Leoben, Austria
Gil Rosenman, Tel Aviv University, Israel
Carsten Schuh, Siemens, Munich, Germany
Mamoru Senna, Keio University, Japan
Yosuke Shiratori, University of Tokyo, Japan
Michael Stelter, Fraunhofer Institute, Dresden, Germany
Toshi Tani, Toyota Central R&D Laboratories, Japan
Tseng-Yuen Tseng, National Taiwan Normal University, Taiwan
Bruce Tuttle, Sandia National Laboratories, USA
Irina Vendik, St Petersburg University, Russia
Dwight Viehland, Virginia Tech, USA
Anthony West, University of Sheffield, UK
Masahiro Yoshimura,Tokyo Institute of Technology, Japan
Processing
- Marija Kosec, Institute Jozef Stefan, Slovenia
- Tim Button, University of Birmingham, UK
- Andreas Roosen, University of Erlangen, Germany
Basic Science
- David Payne, University of Illinois, USA
- Derek Sinclair, University of Sheffield, UK
- Paolo Nanni, University of Genoa, Italy
Characterisation
- Marek Faryna, Krakow, Poland
- Ian Reaney, University of Sheffield, UK
Dielectrics and Ferroelectrics: Basic Science
- Stan Kamba, Institute of Physics Prague, Czech Republic
- Andrew Bell, University of Leeds, UK
Dielectrics and Ferroelectrics: Multiferroics
- Neil Alford, Imperial College, London, UK
- Matjaz Valant, University of Nova Gorica, Slovenia
- Andrew Bell, University of Leeds, UK
Dielectrics and Ferroelectrics: Piezoelectrics
- Jurgen Roedel, University of Darmstadt, Germany
- Rob Dorey, Cranfield University, UK
- HG Kim, KAIST, Korea
Dielectrics and Ferroelectrics: Microwave Dielectrics and Metamaterials
- Spartak Gevorgian, Chalmers University, Sweden
- Heli Jantunen, University of Oulu, Finland
- Bob Clarke, NPL, UK
Dielectrics and Ferroelectrics: LTCC
- Heli Jantunen, University of Oulu, Finland
- Danilo Suvorov, Institute Jozef Stefan, Slovenia
- Derek Sinclair, University of Sheffield, UK
Thin Films
- Martin Gregg, Queens University Belfast, UK
- SB Krupanidhi, IIS, Bangalore, India
Sensors and Actuators
- Pim Groen, TNO, The Netherlands
- John Wang, National University of Singapore, Singapore
Interfaces
- Fernando Marques, University of Aveiro, Portugal
- John Irvine, University of St Andrews, UK
- Enrico Traversa, University of Rome "Tor Vergata", Italy
Ionic and Electronic Conductors; Energy Devices
- Harry Tuller, Massachusetts Institute of Technology, USA
- John Irvine, University of St Andrews, UK
Superconductors and Magnetics
- Matt Rosseinsky, University of Liverpool, UK
Thermistors and Varistors
- José Varela, UNESP, Brazil
- Colin Leach, University of Manchester, UK
Biological and Medical Applications
- Yuri Dekhtyar, Riga Technical University, Latvia
COST539
- Biljana Stovanovic, Serbia